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Wafer cleaning is one of the most vital stages in electronics production. Industries demand effective and efficient wafer cleaning equipment that can remove contaminants and impurities. Impurities can affect the functionality of the wafer and therefore, wafer cleaning equipment’s are used to remove the impurities like alkali, metal, heavy metals, organic components without damaging the wafer surface. It increases the efficiency of work.
The rise in automation and printed electronic industry in Europe drives the growth of the wafer cleaning equipment market. The demand for miniature electronic devices and smart portable electronic devices is increasing rapidly, which encourages the industries to increase their production capacities. A rise in production capacity enhances the growth of the wafer cleaning equipment market.
The study analyses the European wafer cleaning equipment market based on equipment, technology, application, size, operational mode and geography.
Single wafer spray, single wafer cryogenic, batch immersion cleaning system, batch spray cleaning system and scrubber are various wafer cleaning equipment’s. A single wafer spray is the most demanding equipment in industries, as layers continue to expand and devices continue to shrink. It is a very promising cleaning system that removes contaminants with minimal damage to the wafer surface. Highly demanding miniature devices and complex fabrication process increases the need for single wafer spray equipment’s. Whereas, the batch spray cleaning system provide various benefits like processing multiple wafers at one time. It helps in saving time and cleaning cost and delivers large profit to volume manufacturers.
Major wafer cleaning technologies covered in the study are wet chemical cleaning, vapor dry cleaning, aqueous cleaning process, cryogenic aerosols, and super-critical fluid cleaning process. Based on technology, wet chemical cleaning process is likely to dominate the market. Wet chemical cleaning technology uses a chemical process to remove impurities. Each wafer is treated with hydrofluoric acid. Vapor dry cleaning improves the worker's safety by reducing the amount of acid, bases and solvent consumed and disposed of.
Applications of wafer cleaning equipment include MEMS, CIS memory, RFID device, LED Interposer, and others. Increasing demand for electronic components and smartphone drives the growth of the wafer cleaning equipment market. The market for LED applications is increasing rapidly which positively affects the growth of the market. The use of RFID devices is increasing rapidly as they are being integrated into various electronics and identity solutions such as identification tags and smart cards. It increases the demand for clean wafers to be incorporated seamlessly into these devices.
By size, the wafer cleaning equipment is bifurcated into <150mm, 200mm and 300mm. 300mm wafers have the highest share in the wafer cleaning equipment market. 300 mm wafers are more effective hence their adoption in the LED sector has increased.
Wafer cleaning equipment is available in automated, semi-automated, and manual modes. Automated wafer cleaning equipment can operate without any external operating input. They provide advantages of accurate chemical dosage, precise timing of process steps, and exact replication of the process sequence. The automated operations minimize chemical use and help to reduce waste. The output in automated wafer cleaning equipment is constant, the number of defective products is lowered as compared to manual and semi-automated equipment which increases the quality of product.
Geographically, the study is comprised of key countries such as Germany, France, UK, Italy, Spain, and Rest of Europe. Technological advancements and rise in demand for electronic devices drives the growth of the wafer cleaning equipment market in the European countries.
The key competitors of this market include SCHMID Group (Germany), Inseto (UK), RENA (Germany), and Felcon (UK) among others.
The study analyses the European wafer cleaning equipment market based on equipment, technology, application, size, operational mode and geography. Single wafer spray, single wafer cryogenic, batch immersion cleaning system, batch spray cleaning system and scrubber are various wafer cleaning equipment’s. Major wafer cleaning technologies covered in the study are wet chemical cleaning, vapor dry cleaning, aqueous cleaning process, cryogenic aerosols, and super-critical fluid cleaning process. Applications of wafer cleaning equipment are MEMS, CIS memory, RFID device, LED Interposer, and others. By size, the wafer cleaning equipment market is bifurcated into <150mm, 200mm and 300mm. Wafer cleaning equipment is available in automated, semi-automated, and manual modes. Geographically, the study is comprised of key countries such as Germany, France, UK, Italy, Spain, and Rest of Europe.
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