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Ball bonding is a special type of wire bonding, and is the most widely used and most common method to create the electrical interconnections between a chip and semiconductor device fabrication. The connection is made using a thin wire which is usually made of aluminum, copper, silver, or gold. The instrument or device used for this ball bonding method is known as ball bonder machine. This machine is widely used in several applications such as in Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Testing (OSATs).
The global ball bonder machine market has been seen ample growth from the past few years. The market for ball bonder machines is primarily driven by large-scale adoption of these machine in semiconductor manufacturing industry across the globe. Additionally, factors such as growing market for electronics and semiconductor manufacturing industry across the world, rise in the production of advanced electronics products, growing technological advancements, and rising consumer demand for consumer electronics products such as Smartphones, tablets and other electronics products are likely to expand growth of the market during projected time frame. Nevertheless, high cost associated with the ball bonder machine is major restraining factor that could hamper the growth of market.
The study analyses Global Ball Bonder Machine Market based on type, application and geography.
Based on type, fully automatic segment is likely to grow at high growth rate. An increasing demand for fully automatic ball bonder machine in electronics industry owing to its benefit such as real-time process & performance monitoring, equipment health monitoring, detection and enhanced post bond inspection and easy operations is key driving factor behind the growth of the segment.
Based on packaging, semiconductor and electronics segment is projected to witness fast growth during forecast period. A surge in the adoption of ball bonder machines for the manufacturing of integrated circuits or chips and for the fabrication of the various semiconductor devices in electronics and semiconductor industry is major factor that attributed to the growth of market. Moreover, factors such as increasing investments by the government and private entities to boost manufacturing of semiconductor based devices and to improve economy, growing technological advancements in electronics packaging industry and vast presence low cost labor and low cost raw materials are impelling the growth of market.
Geographically, the study is comprised of the key countries of North America, Europe, Asia-Pacific and Rest of the World. Asia Pacific held the largest market share of global ball bonder machine market and is likely to dominate the market over the estimated time frame. The economies such as China, Japan and India are dominating the market. The factors such as growing market for consumer electronics and semiconductor manufacturing industry across the region and increasing population of the countries such as India and China along with the increased demand for electronics products such as Smartphone, wearable electronics and other smart connected devices are attributed to the growth of the market.
ASM Pacific Technology (ASMPT), DIAS Automation, F&K Delvotec Bondtechnik, Hesse GmbH, Hybond, Inc., KAIJO Corporation, Kulicke & Soffa Industries, Inc, Micro Point Pro Ltd (MPP), Palomar Technologies, TPT Wire Bonder GmbH & Co KG, Ultrasonic Engineering Co. Ltd are the key players present in the market.
The study analyses global Ball Bonder Machine market based on type, application, and geography. Ball bonder machine market by material is segmented into fully automatic, semi-automatic, and manual. The fully automatic segment is likely to dominate the market over the forecast period. Increased adoption of automated ball bonder machines advanced packaging applications is attributed to the market growth. The market finds application in packaging, semiconductor & electronics, it & telecommunication, and others. The semiconductor and electronics segment is likely to register fastest growth in years to come owing to growing demand for consumer electronics product. Geographically, the study is comprised of the key countries of North America, Europe, Asia-Pacific and Rest of the World.
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